JPH0420587Y2 - - Google Patents
Info
- Publication number
- JPH0420587Y2 JPH0420587Y2 JP1987020837U JP2083787U JPH0420587Y2 JP H0420587 Y2 JPH0420587 Y2 JP H0420587Y2 JP 1987020837 U JP1987020837 U JP 1987020837U JP 2083787 U JP2083787 U JP 2083787U JP H0420587 Y2 JPH0420587 Y2 JP H0420587Y2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- air vent
- resin
- cavity
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987020837U JPH0420587Y2 (en]) | 1987-02-17 | 1987-02-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987020837U JPH0420587Y2 (en]) | 1987-02-17 | 1987-02-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63128014U JPS63128014U (en]) | 1988-08-22 |
JPH0420587Y2 true JPH0420587Y2 (en]) | 1992-05-12 |
Family
ID=30816717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987020837U Expired JPH0420587Y2 (en]) | 1987-02-17 | 1987-02-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0420587Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3621034B2 (ja) * | 2000-10-02 | 2005-02-16 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61117842A (ja) * | 1984-11-14 | 1986-06-05 | Hitachi Micro Comput Eng Ltd | 成形装置 |
-
1987
- 1987-02-17 JP JP1987020837U patent/JPH0420587Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63128014U (en]) | 1988-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0420587Y2 (en]) | ||
JPH01268159A (ja) | 樹脂封止半導体装置及び成型用金型 | |
JPH0356338Y2 (en]) | ||
JPH079614Y2 (ja) | 熱硬化性樹脂封止用金型 | |
JPS58184839U (ja) | 樹脂モ−ルド装置 | |
JPS6113952U (ja) | 半導体装置用リ−ドフレ−ム | |
JP2664945B2 (ja) | 半導体装置の樹脂封止金型 | |
JPS63159830U (en]) | ||
JPS5839868Y2 (ja) | 樹脂封止金型 | |
JPS61179746U (en]) | ||
JPS62197852U (en]) | ||
JPS62188143U (en]) | ||
JPS5810357Y2 (ja) | 樹脂封止用装置 | |
JPH0610682Y2 (ja) | 樹脂封止形半導体装置成形用モールド金型 | |
JPH0377455U (en]) | ||
JPS5911441U (ja) | 半導体パツケ−ジ用モ−ルド金型 | |
JPH02102742U (en]) | ||
JPS60182141A (ja) | モ−ルド金型 | |
JPS59109143U (ja) | 半導体素子の樹脂封入成形用金型装置 | |
JPH02232957A (ja) | 樹脂封止型半導体装置用のリードフレーム | |
JPS62152452U (en]) | ||
JPS5839812U (ja) | 樹脂封入成形用金型装置 | |
JPS6357742U (en]) | ||
JPS63159845U (en]) | ||
JPH01156016U (en]) |